现金网

现金网

中文版 | English

全国服务热线:0755-27798216

物联网_物联网方案

物联网 物联网方案
技术支持

深圳市霏凡鑫鑫电子科技有限公司
联系人:万芳 13713518225
电话:0755-27798216 分机603
传真:0755-27794501
邮编:518103
地址:深圳市宝安区福永街道桥头福瑞路5号H栋4楼
LCM 介绍
LCM Technology
COB
COB (Chip-on-Board) is a popular IC mounting method that provides wire bonding as the direct attachment of bare die to laminated printed circuit boards. The LCD driver is ted into an area on the PCB. Electrical connections are made by micro diameter gold wires. The entire area is then covered with epoxy. Most of TV standard Character LCD modules are the Chip-On-Board design.
Features:
Space savings over Surface Mount Technology assembly.
Less cost but not good at ESD&EMI.

COG
COG (Chip-On-Glass) is one of the high-tech mounting methods that uses Gold Bump or Flip Chip IC, and implemented in most compact applications. Chip-On-Glass integrated circuits were first introduced by Epson. In flip-chip mounting, the IC chip is not packaged but is mounted directly onto the PCB as a bare chip. Because there is no package, the mounted footprint of the IC can be minimized, along with the required size of the PCB. This technology reduces a mounting area and is better suited to handling high-speed or high-frequency signals.
Features:
Use very commonly in factory.
Chip-On-Glass LCD modules can be as thin as 2 mm.
Cost effective over COB, especially in graphic LCD modules, because much less IC’s are required.

TAB
TAB (Tape Automated Bonding) LCD driver or controller electronics are encapsulated in a thin, hard bubble package, of which the drive leads extend from the bubble package on a thin plastic substrate. The adhesive along the edges is used to attach the TAB to the LCD glass and/or PCB. Tape Automated Bonding IC mounting method uses the same type of integrated circuits as Chip-On-Glass technology - Gold Bumped Flip Chips.
Features:
Can provide interfacing at very fine pitches.
Offer compactness (IC and its interfacing circuitry can be bent behind the LCD glass panel).
The active area is centered (differently from COG).
The bonding area is weak and less reliable than COG.

SMT
SMT (Surface Mounting Technology) using quad flat packages on printed circuit boards was the most popular at the early years of liquid crystal display industry, and is still available for mass production.Plastic Quad Flat Package (QFP) represents itself as a flat rectangular integrated circuit package with its leads projecting from all four sides of the package without radius.
Features:
Good at ESD and EMI.

官方二维码
博九彩票充值www.lovehehe.com版权所有 © 2018 深圳市霏凡鑫鑫电子科技有限公司 All Right Reserved. 粤ICP备14092473号
展开
  • QQ咨询

  • 万小姐
  • 杨先生
  • 电话咨询

  • 0755-27798216
官方二维码
友情链接:博九彩票客服  博九彩票充值中心  博九彩票在线棋牌  博九彩票充值  博九彩票网址  博九彩票备用网址  博九彩票计划软件  博九彩票APP下载  博九彩票微信群  博九彩票登陆  博九彩票免费计划  博九彩票计划软件  博九彩票备用网址  博九彩票在线棋牌  博九彩票代理  博九彩票开户  博九彩票客服  博九彩票注册  博九彩票登陆  博九彩票注册  

免责声明: 本站资料及图片来源互联网文章,本网不承担任何由内容信息所引起的争议和法律责任。所有作品版权归原创作者所有,与本站立场无关,如用户分享不慎侵犯了您的权益,请联系我们告知,我们将做删除处理!